NOX TG-1 heat sink compound Thermal paste 2.5 W/m·K
NOX TG-1, Thermal paste, 2.5 W/m·K, 3.69 g/cm³, Grey, 850 poise, -30 - 240 °C
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Product Information
Nox TG1 is a high performance thermal grease, designed for high demanding applications. A premium thermal compound with high thermal conductivity, low thermal resistance and no electrical conductivity, specially designed for its use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks.
Product
Packaging data
Quantity per pack
1 pc(s)
Features
Type
Thermal paste
Thermal conductivity
2.5 W/m·K
Density
3.69 g/cm³
Product colour
Grey
Viscosity note
850 poise
Operating temperature (T-T)
-30 - 240 °C
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