ENDORFY Pactum 4 heat sink compound Thermal paste 12 W/m·K 1.5 g
ENDORFY Pactum 4, Thermal paste, 12 W/m·K, 2.6 g/cm³, 1.5 g, 1 pc(s), Blister
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Product Information
Pactum 4 1.5 g
Thermal paste Pactum 4 1.5 g is like AC on a hot night – when applied pleasantly cools the warmed up components.
You can put it on in seconds. You only need to thinly spread the paste on the surface of the processor with the included spatula and that's it. You can install cooler now.
Product
- Name
- ENDORFY Pactum 4 heat sink compound Thermal paste 12 W/m·K 1.5 g
- Category
- Heat Sink Compounds
- Brand
- ENDORFY
Weight & dimensions
- Weight
- 1.5 g
Packaging data
- Quantity per pack
- 1 pc(s)
- Package type
- Blister
Features
- Type
- Thermal paste
- Thermal conductivity
- 12 W/m·K
- Specific gravity
- 2.6 g/cm³
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