Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g
Gembird TG-G15-02, Thermal paste, 4.63 W/m·K, 3.15 g/cm³, Silicone, 15%, 35%
| Date | Price |
|---|---|
| 15 August 2026 | £33 |
| 27 August 2026 | £33 |
| 28 August 2026 | £27 |
| 30 August 2026 | £33 |
| 31 August 2026 | £27 |
| 2 September 2026 | £33 |
| 6 September 2026 | £27 |
| 15 September 2026 | £33 |
| 17 September 2026 | £28 |
| 18 September 2026 | £28 |
| 20 September 2026 | £33 |
| 21 September 2026 | £33 |
| 6 October 2026 | £10.26 |
| 12 October 2026 | £10.23 |
Compare Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g prices UK
*Date of last price update
User Notice: We regularly reference new offers to provide you with the widest selection. However, the displayed results do not reflect all available offers on the market. By default, offers are sorted by price, with the lowest price appearing first.
Product Information
Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Product
- Name
- Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g
- Category
- Heat Sink Compounds
- Brand
- Gembird
Weight & dimensions
- Width
- 30 mm
- Depth
- 35 mm
- Height
- 30 mm
- Weight
- 24 g
Packaging data
- Quantity per pack
- 400 pc(s)
- Package width
- 30 mm
- Package depth
- 35 mm
- Package height
- 30 mm
- Package weight
- 30 g
Logistics data
- Country of origin
- China
Features
- Type
- Thermal paste
- Thermal conductivity
- 4.63 W/m·K
- Density
- 3.15 g/cm³
- Constitutive ingredients
- Silicone
- Silicone percentage
- 15%
- Carbon percentage
- 35%
- Product colour
- Grey
- Viscosity note
- 12500 Pa s
- Thermal resistance
- 0.0087 °C/W
- Operating temperature (T-T)
- -30 - 280 °C
- Certification
- RoHS, CE
Customer Reviews
Share your opinion on the product or read reviews from other members.
