NOX Thermal T1 heat sink compound 8.3 W/m·K 4 g

NOX Thermal T1, 8.3 W/m·K, 3.7 g/cm³, Carbon, Metal oxide, Silicone, 20%, 25%, 55%

NOX Thermal T1 heat sink compound 8.3 W/m·K 4 g

NOX Thermal T1, 8.3 W/m·K, 3.7 g/cm³, Carbon, Metal oxide, Silicone, 20%, 25%, 55%

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Product Information

High Efficiency Thermal Grease

The Hummer Thermal T1 thermal paste is composed of carbon microparticles that guarantee high conductivity and low thermal impedance for those machines that demand high performance for hours.

Thanks to its precision applicator and spatula you can extend or remove the paste in a simple and precise way to ensure that the heat generated by the CPU or GPU dissipates quickly and efficiently.

In addition, the Hummer T1 stands up to a wide temperature range (-50~280ºC), and is dielectric, which avoids possible short circuits caused by an undue electrical conductivity, making it the perfect ally for overclockers.

Heat Sink Compounds NOX
Product
Name
NOX Thermal T1 heat sink compound 8.3 W/m·K 4 g
Brand
Technical details
Moment beared temperature
-50 - 280 °C
Thixotropic Index (TI)
350
Compliance certificates
RoHS
Easy cleaning
Yes
Weight & dimensions
Weight
4 g
Packaging data
Quantity per pack
1 pc(s)
Spatula
Yes
Applicator
Yes
Package weight
25 g
Package type
Blister
Features
Thermal conductivity
8.3 W/m·K
Density
3.7 g/cm³
Constitutive ingredients
Carbon, Metal oxide, Silicone
Silicone percentage
20%
Carbon percentage
25%
Metal oxide percentage
55%
Product colour
Grey, Yellow
Non-conductive
Yes
Viscosity note
10000 CPS
Thermal resistance
0.0014 °C/W
Compatible products
CPU, GPU
Operating temperature (T-T)
-30 - 240 °C
Certification
CE
NOTE: The above information is provided for your convenience only, and we cannot guarantee its accuracy with the seller.

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