NOX Thermal T1 heat sink compound 8.3 W/m·K 4 g

NOX Thermal T1 heat sink compound 8.3 W/m·K 4 g
NOX Thermal T1, 8.3 W/m·K, 3.7 g/cm³, Carbon, Metal oxide, Silicone, 20%, 25%, 55%
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Product Information
High Efficiency Thermal Grease
The Hummer Thermal T1 thermal paste is composed of carbon microparticles that guarantee high conductivity and low thermal impedance for those machines that demand high performance for hours.
Thanks to its precision applicator and spatula you can extend or remove the paste in a simple and precise way to ensure that the heat generated by the CPU or GPU dissipates quickly and efficiently.
In addition, the Hummer T1 stands up to a wide temperature range (-50~280ºC), and is dielectric, which avoids possible short circuits caused by an undue electrical conductivity, making it the perfect ally for overclockers.
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