Iceberg Thermal FUZEIce heat sink compound Thermal paste 11.25 W/m·K 3.5 g
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Product Information
Low Temperature with High Thermal Conductivity
Evenly spread layers of thermal paste with a high thermal conductivity of 11.25 W/mK, ensures high-efficiency heat transfer, allowing for higher clock speeds, and keeping your system in peak condition
No Spatula? No Problem!
Precision Applicator and Angled Spreader Combination designed with Ease of Use in mind.
Making it simple to apply with less mess.
Superior Operational Temperature
FUZEIce™ can handle up to 200°C and last for years!
There’s no paste like FUZEIce™
No Fuss, No Muss, No Problem
Product
Name
Iceberg Thermal FUZEIce heat sink compound Thermal paste 11.25 W/m·K 3.5 g
Category
Brand
Weight & dimensions
Weight
3.5 g
Packaging data
Quantity per pack
1 pc(s)
Features
Type
Thermal paste
Thermal conductivity
11.25 W/m·K
Density
2.6 g/cm³
Product colour
Green
Viscosity note
56000 poise
Operating temperature (T-T)
-50 - 200 °C
NOTE: The above information is provided for your convenience only, and we cannot guarantee its accuracy with the seller.
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