ENDORFY Pactum 4, Thermal paste, 12 W/m·K, 2.6 g/cm³, 1.5 g, 1 pc(s), Blister

ENDORFY Pactum 4 heat sink compound Thermal paste 12 W/m·K 1.5 g

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Product Information

Pactum 4 1.5 g
Thermal paste Pactum 4 1.5 g is like AC on a hot night – when applied pleasantly cools the warmed up components.

You can put it on in seconds. You only need to thinly spread the paste on the surface of the processor with the included spatula and that's it. You can install cooler now.

Heat Sink Compounds ENDORFY
Product
Name
ENDORFY Pactum 4 heat sink compound Thermal paste 12 W/m·K 1.5 g
Brand
Weight & dimensions
Weight
1.5 g
Packaging data
Quantity per pack
1 pc(s)
Package type
Blister
Features
Type
Thermal paste
Thermal conductivity
12 W/m·K
Specific gravity
2.6 g/cm³
NOTE: The above information is provided for your convenience only, and we cannot guarantee its accuracy with the seller.

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