Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g
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Product Information
Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Product
Name
Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g
Category
Brand
Weight & dimensions
Width
30 mm
Depth
35 mm
Height
30 mm
Weight
24 g
Packaging data
Quantity per pack
400 pc(s)
Package width
30 mm
Package depth
35 mm
Package height
30 mm
Package weight
30 g
Logistics data
Country of origin
China
Features
Type
Thermal paste
Thermal conductivity
4.63 W/m·K
Density
3.15 g/cm³
Constitutive ingredients
Silicone
Silicone percentage
15%
Carbon percentage
35%
Product colour
Grey
Viscosity note
12500 Pa s
Thermal resistance
0.0087 °C/W
Operating temperature (T-T)
-30 - 280 °C
Certification
RoHS, CE
NOTE: The above information is provided for your convenience only, and we cannot guarantee its accuracy with the seller.
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