Gembird TG-G1.5-01, 4.5 W/m·K, Grey, 76 CPS, 0.205 °C/W, -50 - 240 °C, 50 mm

Gembird TG-G1.5-01 heat sink compound 4.5 W/m·K 1.5 g

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    Product Information

    Thermal compund (grease) for heatsinks
    Helps the heat dissipation from a CPU, chipset or processor to a heatsink
    Excellent thermal impedance
    Perfect stability - will not separate, run, migrate, or bleed
    Non capacitive or electrically conductive

    Heat Sink Compounds Gembird
    Product
    Name
    Gembird TG-G1.5-01 heat sink compound 4.5 W/m·K 1.5 g
    Category
    Heat Sink Compounds
    Brand
    Gembird
    Technical details
    Compliance certificates
    RoHS
    Weight & dimensions
    Width
    50 mm
    Depth
    80 mm
    Height
    15 mm
    Weight
    1.5 g
    Packaging data
    Package width
    60 mm
    Package depth
    150 mm
    Package height
    20 mm
    Package weight
    19 g
    Features
    Thermal conductivity
    4.5 W/m·K
    Product colour
    Grey
    Viscosity note
    76 CPS
    Thermal resistance
    0.205 °C/W
    Operating temperature (T-T)
    -50 - 240 °C
    NOTE: The above information is provided for your convenience only, and we cannot guarantee its accuracy with the seller.

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