Gelid Solutions TP-GP04-A heat sink compound Thermal paste

The GP-Ultimate is designed to provide perfect thermal contact to heatsinks when installed on PCB with height differences and uneven surfaces such as power MOSFETs, chipsets, analog ICs, micro-controller units and other high-temperature SMD components. Thanks to its enhanced multilayer matrix, superior material composition and the ultimate thermal conductivity, the GP-Ultimate fills spaces properly and offers the best performance in class.



The GP-Ultimate is non-electrical conductive, non-corrosive, non-curing, non-toxic and supports extended operating temperature range -60°C to 220°C. It features easy application and has the thermal pad dimensions of 90x50mm to best fit for large PCB surfaces of GPU cards, motherboards, add-on cards and any other densely packed electronic device.