Biostar A960D+V3 motherboard AMD 760G Socket AM3+ micro ATX

HD Audio
Provides high quality sound with minimal loss of audio fidelity.

DVI
DVI is better than VGA for LCD displays since it is digital while VGA is analog. For LCD displays, the picture is digitized pixel per pixel. Through DVI, the panel gets data for each pixel, so the picture generated in the Graphics device matches the pixels on the panel itself.

Moistureproof PCB
The popularity of PC usage and working environment is getting deteriorating and moist(rural, coastal, etc.). The PCB will be oxidizing easily by damp or absorbed moisture, and ionic migration or CAF (Conductive Anodic Filament) will be generated. Moisture-proof PCB meets high density and high reliability requirements for moisture proof.

Low RdsOn P-Pak MOS
Low resistance design can significantly reduce the current out of energy loss.Low temperature, small size, excellent thermal conductivity.

ESD Protection
ESD (Electrostatic Discharge) is the major factor to destroy PC by electrical overstress(EOS) condition, ESD occurred by PC users when touch any devices connect to PC, which may result in damage to motherboard or parts .ESD protection is designed to protect the motherboard and equipment from damage by EOS

USB Polyswitch
On board dedicated power fuse to help prevent USB port failure. It prevents USB Port overcurrent and safegurand your system and device lifespan.

OC / OV / OH Protection
All BIOSTAR special circuit design detects overvoltage conditions and prevents voltage surges from spreading in real time. It also actively cuts off the overvoltage supply to protect your system. Over current protection, avoid motherboard from damage when doing overclock or an unusual current import. Over heat protection, avoid motherboard & CPU from burning when exceeding the temperature limitation.

AM3/AM2+ Support
Supporting upcoming AMD Socket AM3/AM2+ 45nm processors, it delivers better overclocking capabilities and reduces power consumption. Moreover, AM3 CPU supports both DDR2 /DDR3 memory module and accelerates data transfer rate by up to 5200MT/s via HyperTransport 3.0 technology.