XPG LANCER, 64 GB, 2 x 32 GB, DDR5, 6000 MHz, 288-pin DIMM

XPG LANCER memory module 64 GB 2 x 32 GB DDR5 6000 MHz ECC

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    Product Information

    LANCER BLADE DDR5
    SLEEK EFFICIENCY, COMPACT POWER

    Compact Low-Profile Heatsink Design
    The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.

    Enhanced Power Management
    The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.

    Stability and Reliability
    With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.

    Made with High-Quality Materials
    High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.

    AMD EXPO
    Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.

    Overclocking Made Easy
    With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.

    Memory Modules XPG
    Product
    Name
    XPG LANCER memory module 64 GB 2 x 32 GB DDR5 6000 MHz ECC
    Brand
    Operational conditions
    Operating temperature (T-T)
    0 - 85 °C
    Storage temperature (T-T)
    -20 - 65 °C
    Features
    Internal memory
    64 GB
    Memory layout (modules x size)
    2 x 32 GB
    Internal memory type
    DDR5
    Memory clock speed
    6000 MHz
    Component for
    PC
    Memory form factor
    288-pin DIMM
    ECC
    Yes
    Buffered memory type
    Unregistered (unbuffered)
    CAS latency
    30
    Memory voltage
    1.35 V
    Intel Extreme Memory Profile (XMP)
    Yes
    Intel Extreme Memory Profile (XMP) version
    3.0
    Cooling type
    Heatsink
    Packaging data
    Package width
    122 mm
    Package depth
    150 mm
    Package height
    15.5 mm
    Package weight
    162.76 g
    Package type
    Blister
    NOTE: The above information is provided for your convenience only, and we cannot guarantee its accuracy with the seller.

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