Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
From £29.30
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Product Information
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Product
Technical details
Compliance certificates
RoHS
Weight & dimensions
Width
120 mm
Depth
180 mm
Height
15 mm
Weight
3 g
Packaging data
Package width
120 mm
Package depth
180 mm
Package height
15 mm
Package weight
33 g
Features
Thermal conductivity
4.5 W/m·K
Product colour
Grey
Viscosity note
76 CPS
Thermal resistance
0.205 °C/W
Operating temperature (T-T)
-50 - 240 °C
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