Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
From £101.88
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Product Information
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
Product
Technical details
Compliance certificates
RoHS
Weight & dimensions
Weight
3 g
Packaging data
Quantity per pack
1 pc(s)
Package width
120 mm
Package depth
20 mm
Package height
10 mm
Features
Thermal conductivity
5.15 W/m·K
Product colour
Black, Red, White
Viscosity note
73 CPS
Thermal resistance
0.201 °C/W
Operating temperature (T-T)
-30 - 280 °C
Certification
CE
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