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Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 7600 MHz ECC

Team Group XTREEM FFXD532G7600HC36FDC01, 32 GB, 2 x 16 GB, DDR5, 7600 MHz, 288-pin DIMM

Best offerPrice trend

£388

-15%
Price trend
Detailed analysis ›
Price history of Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 7600 MHz ECC over the last 3 months
DatePrice
21 July 2026£457
25 July 2026£457
30 July 2026£416
5 August 2026£416
13 August 2026£416
23 August 2026£407
27 August 2026£406
1 September 2026£440
6 September 2026£406
14 September 2026£406
20 September 2026£462
26 September 2026£416
2 October 2026£349
12 October 2026£388
13 October 2026£388

Compare Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 7600 MHz ECC prices UK

Product Information

Honorable T-FORCE Logo exceeds overclocking limits
With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.

Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.

Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.

High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.

Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.

On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.

Memory Modules Team Group

Product

Name
Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 7600 MHz ECC

Weight & dimensions

Width
8.2 mm
Depth
134.5 mm
Height
48.8 mm

Features

Internal memory
32 GB
Memory layout (modules x size)
2 x 16 GB
Internal memory type
DDR5
Memory clock speed
7600 MHz
Component for
PC
Memory form factor
288-pin DIMM
ECC
Yes
Buffered memory type
Registered (buffered)
On-Die ECC
Yes
CAS latency
36
Memory voltage
1.4 V
Cooling type
Heatsink

Packaging data

Package type
Box

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